ROLE
– Own the end-to-end architecture, design, bring-up, and qualification of the Camera Electronics stack for a multispectral payload
– Define robust CE architecture, ICDs, dataflow, clocks/resets, power domains, fault handling, safe-mode hooks
– Lead schematic + PCB design, DFM/DFT, EMI/EMC practices, grounding/fusing, thermal conduction design
– Own sensor/ROIC electrical interface spec, timing budgets, exposure/control loops, register maps
– Architect high-throughput RTL and timing closure
– Boot chain, QSPI/NAND, Linux/RTOS drivers, board support, and production-ready images
– Lead a team of engineers to achieve the above milestones
– Hardware–firmware co-design, SI validation, and test-as-you-fly mindset

REQUIREMENTS
– More than 6 years in embedded hardware + FPGA/SoC systems shipping real high-speed products
– Deep hands-on with DDR3/DDR4, PCIe, high-speed transceivers, and board bring-up
– Strong FPGA/SoC experience: Xilinx/AMD Zynq UltraScale+ and/or Versal
– Fundamental knowledge of Real time operating system or Bare metal coding
– Proven ownership: architecture → implementation → debug → validation → release
– Comfortable leading a small team and driving cross-functional execution
– Space-grade design practices: radiation mitigation, de-rating, watchdog/fault tolerance
– Familiarity with SLVS-EC or similar next-gen CMOS sensor interfaces